SEMION INSTRUMENTATION

Semion LLC makes use of a FEI XL835 Dualbeam FIB/Field Emission SEM which allows nondestructive imaging of FIB milling processes as they progress.

The FEI xl835 dualbeam system is capable of focused ion beam milling, ion beam deposition and electron beam deposition. Deposition materials include Platinum, Molybdenum, Tungsten, Silicon Oxide, and Carbon.

The dualbeam system is equipped with an EDAX EDS system for high resolution elemental analysis. In combination with the FIB the EDS system has the unique ability to identify elements below the surface of the object being analyzed.

The Semion LLC Dualbeam FIB system is equipped with a sample extraction probe that allows tiny sub-micron sized fragments of a sample to be extracted and remounted. This is particularly useful for producing STEM images or TEM images.

This system has the versatility to image and ion mill samples from very small fragments to full 200mm wafers. It is also capable of accepting 300mm wafers for viewing and milling of the center 100mm area.

The system is loadlocked for quick sample throughput and cleanliness. A 200mm wafer may be placed in the process chamber in just over 1 minute.

The Semion facility may be visited and equipment may be viewed by appointment. Please contact Semion for more information.