SEM, TEM and FIB analytical services for full 300mm semiconductor wafers and pieces, materials samples and biological specimens
Let Semion handle these common SEM, FIB and TEM applications, freeing you to focus your resources on proprietary research or more demanding applications work. We're here to support your research, help you get the answers you need in a timely manner, and keep your projects on schedule.
With our Expida DualBeam, we are able to perform all requested FIB, SEM or sample preparation work on full 300mm wafers without breaking the wafers.
High Resolution SEM/STEM Imaging
Semion will perform Scanning Electron Microscope (SEM) imaging at specified locations or features. We can apply several imaging modes to deliver complementary data: Backscatter Electron (BSE) Detection for material-related contrast; Low Energy Secondary Electron Detection for topographic data; and Scanning Transmission Electron Microscopy (STEM) to reveal contrast otherwise not visible between materials.
FIB Cross Sectioning
Focused Ion Beam (FIB) milling selectively removes material from the sample to expose features not visible on the surface, giving you a view of defects or structures that could not otherwise be measured or analyzed. Semion will perform FIB cross sectioning at the areas you specify for metrology, defect analysis, high resolution imaging, or EDS analysis.
High Resolution TEM Imaging
Transmission Electron Microscopy (TEM) delivers information to the Ångstrom scale, allowing further study for gate structures, materials interfaces and atomic structure. Semion can work from your prepared samples, or can use their suite of tools to prepare your samples for TEM, then provide you with image data for your materials.
Semion prepares your samples for a variety of imaging and analytical techniques: TEM, STEM, X-ray microscopy, tomography or analysis (EDS, EBSD). Semion utilizes FIB and SEM to optimally prepare your samples, then mount them to a grid or other specimen holder to return them to you ready for analysis.
Semion makes use of Energy Dispersive Spectroscopy (EDS) technology to collect high resolution elemental data from surface and subsurface features. We can work from samples that you have prepared, or we can handle the preparation. You will receive elemental maps and spectral data, along with the full image series.
Probe Milling; Device Edit and Fabrication
Semion can support you with FIB circuit edits on your prototype devices, or create micro and nanoscale devices structures from your pattern files. Semion also uses FIB milling to sharpen or customize AFM and other probes or filaments for optimum performance.