SERVICES

TEM Sample Preparation: The Transmission Electron Microscope (TEM) can require samples that are very thin. The FIB is the perfect tool for creating a flat and thin sample for ideal TEM image quality. Semion LLC can thin your sample to the desired thickness, extract the thin sample from the substrate, and mount the thin sample on a TEM Grid or other object for final TEM analysis.

Device Editing: The FIB can both mill and deposit material on the surface of a sample. Semion LLC can use the FIB to cut circuit traces and subsequently deposit metal traces rerouting signals to produce a “Blue Wire” edit for device repair or debug.

FIB Cross Sectioning: The most basic function of the FIB is the FIB cross section. The FIB cross section is the removal of material from the sample to expose features not visible on the surface. The cross section face is a plane perpendicular to and below the surface of the sample and it can reveal features that could not otherwise be measured or analyzed.

Probe Milling: AFM and other probes can be optimized through the use of FIB milling. The FIB can sharpen and customize probe tips or filaments.

Elemental Analysis: High Energy Electrons interacting with an Element produce X-Rays unique to that Element. Semion LLC makes use of Energy Dispersive Spectroscopy (EDS) technology to collect these characteristic X-Rays and provide high resolution elemental analysis of surface and subsurface features.

High Resolution SEM Imaging: Semion LLC makes use of a 30kV S-FEG Electron Column. Several electron detection modes are available including Backscatter Electron imaging which can provide unique material related contrast; Scanning Transmission Electron Microscopy (STEM) which can reveal contrast between materials otherwise not visible; Low Energy Secondary Electron Detection provides good topographic data.